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Application of thermal analysis techniques to appraisal and quality control in Japan

机译:热分析技术在日本评估和质量控制中的应用

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摘要

This review deals with both inorganic- and organic-based electrical/electronic materials, including enameled wires, insulating varnishes, epoxy resins, thermoplastic resins, thermoplastic films, thermosetting resins, ferroelectric polymers, mineral-based transformer oils, zinc oxide varistors, rotating machine insulating systems, photoresists, glass-fiber-reinforced plastics, electronic ceramics, and high-T/sub c/ (critical temperature) oxide superconductors. The thermal analysis techniques considered are thermogravity, evolved gas analysis, differential thermal analysis, differential scanning calorimetry, thermomechanical analysis, thermally stimulated current measurement, and photoinduced calorimetry. An attempt is made to clarify how successfully a particular technique can be used for developing new materials or for evaluating a specific practical application of an electrical or electronic material.
机译:这篇评论涉及基于无机和有机的电气/电子材料,包括漆包线,绝缘漆,环氧树脂,热塑性树脂,热塑性薄膜,热固性树脂,铁电聚合物,矿物基变压器油,氧化锌压敏电阻,旋转机械绝缘系统,光致抗蚀剂,玻璃纤维增​​强塑料,电子陶瓷和高T / sub c /(临界温度)氧化物超导体。所考虑的热分析技术为热引力,逸出气体分析,差热分析,差示扫描量热法,热机械分析,热激电流测量和光致测热法。试图阐明特定技术如何成功地用于开发新材料或评估电气或电子材料的特定实际应用。

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