It's going, going, almost gone for analog-function ICs

摘要

Just when you thought they couldn't make them any smaller, National Semiconductor has extended its line of micro-surface-mount-device (SMD) products in wafer-level packaging that began with a dual op amp in September 1998. The line now includes additional op amps, timers, temperature sensors, references, regulators, and even audio amplifiers in four-, five- and eight-bump packages that are the size of the silicon die alone.