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Parasitic inductance of a bypass capacitor

机译:旁路电容器的寄生电感

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You can estimate the parasitic series inductance of a bypass capacitor in a multilayer board with solid power and ground planes. Use an approximation for the inductance L_1 due to the chip layout (Figure 1, green shaded region). Then, assuming that you have connected your chip and your bypass capacitor straight to the planes, use an approximation for the inductance L_2 represented by the volume of magnetic flux trapped between the planes (blue region). Finally, you might want to consider the inductance, L_3, of the chip package itself (red region). The internal details of the construction of a monolithic ceramic capacitor add little to the total inductance.
机译:您可以估计具有固体电源和接地层的多层板中旁路电容器的寄生串联电感。由于芯片的布局(图1,绿色阴影区域),请使用近似值L_1。然后,假设您已将芯片和旁路电容器直接连接到这些平面,则使用电感L_2的近似值,该近似值由两个平面之间捕获的磁通量表示(蓝色区域)。最后,您可能需要考虑芯片封装本身(红色区域)的电感L_3。单片陶瓷电容器结构的内部细节几乎不会增加总电感。

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