Packaging solves 'the last centimeter'

摘要

As IC-process rules have shrunk and operating frequencies have increased, the electrical properties of whole classes of components no longer depend solely on their circuit topologies. More and more the effects of component packaging and interconnections determine what an OEM designer can attain. Although this sounds like a claim that packaging limits a component's electrical properties—an easy argument to make for many IC types—it deserves mentioning that innovations in packaging have enabled product price/performance ratios previously unreachable.