Current-sharing IC audio-power amplifiers drive heavier loads

摘要

Audio-power amplifier ICs suit low-power applications because of their low cost, parts count, and size. Applications demanding higher output power challenge designs based on IC power amplifiers. The IC's normally appealing size can become a disadvantage when you factor in thermal considerations. The size of the IC concentrates the heat flux on a small area on the heat sink, generating large thermal gradients. These gradients limit the power dissipation of the IC as the case temperature rises and approaches the maximum junction temperature.