Looking forward to smaller geometries

摘要

The industry is laying the groundwork for the next technology migration. The geometries of digital- and analog-IC silicon processes are shrinking. As a con- sequence, IC devices continue to have lower power-supply-voltage requirements, silicon areas, and prices. I have witnessed geometries migrate from 1.2 microns to as low as 0.25 microns. I still find that a device function that uses a 0.7-micron process may not work as well if I change to a 0.25-micron process.