Take the HEAT cool that hot embedded design

摘要

THE DESIGN GOALS of many new projects include miniaturization, increased performance, longer battery life, and silent operation. All of these goals run counter to effective thermal management, and designers are facing the prospect of sacrificing performance to handle the excessive heat that modern ICs generate. Cooling problems plague all electronic systems, from the simplest portable devices to complex board-level systems. Although mechanical-packaging engineers typically handle thermal analysis on larger projects, most design teams rely on rules of thumb, experience with similar projects, guidelines from board or chassis manufacturers, simple thermal analysis, and the old standby - trial and error.