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Achieve Precision Temperature Control With Tec Seebeck-voltage Sampling

机译:通过Tec Seebeck电压采样实现精确的温度控制

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TEC (thermoelectric-cooler) temperature-control systems often have limited stability. The causes of these limitations are the thermal properties of the system, not the performance of the control electronics. Real-world thermal-control systems incur nonzero thermal impedances in the heat-transfer paths between the TEC; the thermal load, which is the object of thermostasis; the temperature sensor-for example, a thermistor; and the ambient temperature.rnIf the ratios of these impedances don't balance, then even perfect thermostasis of the sensor's temperature doesn't equate to adequate stability of the load's temperature. The circuit in Figure 1 provides a thermoelectronic design that directly measures the heat flux through the TEC and then uses the measurement to better estimate and cancel the effects of thermal impedances. Its operation is based on the fact that the total voltage that every TEC develops is the sum of two components: an ohmic component proportional to drive current and the Seebeck voltage, V_S, which is proportional to the temperature difference across the TEC and, therefore, to heat flux.
机译:TEC(热电冷却器)温度控制系统通常具有有限的稳定性。这些限制的原因是系统的热性能,而不是控制电子设备的性能。现实世界中的热控制系统在TEC之间的传热路径中会产生非零的热阻抗。热负荷,这是恒温的目的;温度传感器-例如热敏电阻;如果这些阻抗之比不平衡,则传感器温度即使达到完美的热稳定状态也不能等同于负载温度的足够稳定性。图1中的电路提供了一种热电子设计,可以直接测量通过TEC的热通量,然后使用该测量结果更好地估计和消除热阻抗的影响。其操作基于以下事实:每个TEC产生的总电压是两个分量的总和:与驱动电流成比例的欧姆分量和与TEC两端的温差成正比的塞贝克电压V_S。热通量。

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