TI OFFERS FREE WINDOWS EMBEDDED CE 6.0 R3 BSPs

摘要

Texas Instruments has introduced Microsoft Windows Embedded CE 6.0 R3 BSPs (board-support packages) for OMAP (open multimedia applications platform)-L1 x floating-point DSP and ARM9 processors, Sitara AM1x ARM9 microprocessors, and associated evaluation modules. For OMAP-Mx, the BSP provides access to Tl's TMS320C674x DSP using DSP/BIOS Link interpro-cessor-communication software, enabling you to develop algorithms using CE 6.0 R3.