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Trends in Surface Mount Technology and High Power Resistors

机译:表面贴装技术和大功率电阻器的趋势

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Design breakthroughs in electronic components have resulted in remarkable advances producing smaller, more powerful electronic devices. The "downsizing" of processors and the development of busses to increase speed has not only increased the demand for components, it also has created a demand for high-power, precision resistors. In the past, designers may have used leaded wirewounds or large film resistors. Current industrial and automotive designs increasingly require robust surface mount devices (SMD). One of the best devices for this requirement is one of the oldest resistor technologies available: wire-wound resistors. Wirewounds were first commercially manufactured and used circa 1900. Since that time, innovative resistor technologies (for example, carbon composition and film) and package variations have been developed. SMDs were introduced in the late 1970s. Although this new package form was limited to a 1206 case size and a 1/8W rating, it became the original industry standard.
机译:电子组件的设计突破导致了生产较小,功能更强大的电子设备方面的显着进步。处理器的“小型化”和总线的发展以提高速度不仅增加了对组件的需求,还产生了对大功率,精密电阻器的需求。过去,设计人员可能使用带引线的绕线器或大薄膜电阻器。当前的工业和汽车设计越来越需要坚固的表面安装器件(SMD)。满足此要求的最佳设备之一是可用的最古老的电阻器技术之一:线绕电阻器。线绕首先在商业上制造并在1900年左右使用。自那时以来,已开发出创新的电阻器技术(例如,碳成分和薄膜)和封装形式。 SMD是在1970年代后期引入的。尽管这种新的封装形式仅限于1206的外壳尺寸和1 / 8W的额定功率,但它已成为原始的行业标准。

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