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Domain-Optimized FPGAs Address SoC Challenge

机译:域优化的FPGA解决了SoC挑战

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摘要

System-on-a-chip (SoC) design is becoming more complex — and more expensive. Soaring ASIC costs — at $10M and up for 130 nm CMOS technology — along with increased risk associated with new process technologies, is opening the door for a new generation of FPGA architectures to push into the system-on-a-chip (SoC) design realm previously dominated by ASICs. New 90 nm FPGA architectures are enabling domain-optimized platforms that can meet tough design specifications at a reduced cost, and they have the flexibility designers need to deal with current and evolving SoC applications. By combining high-performance, high-density programmable logic with extensive embedded memory resources and flexible high-speed I/O into a single chip, these devices serve as a starting point, or platform, that engineers customize to create circuits that implement their products with unique logic functions.
机译:片上系统(SoC)设计变得越来越复杂,而且价格也越来越昂贵。 ASIC成本飞涨(达到1000万美元并采用130 nm CMOS技术),再加上与新工艺技术相关的风险不断增加,这为新一代FPGA架构推向片上系统(SoC)敞开了大门以前由ASIC主导的设计领域。新的90 nm FPGA架构可实现领域优化平台,从而以较低的成本满足苛刻的设计规范,并且具有设计人员处理当前和不断发展的SoC应用所需的灵活性。通过将高性能,高密度的可编程逻辑与广泛的嵌入式存储器资源和灵活的高速I / O集成到单个芯片中,这些设备可作为工程师定制的起点或平台,以创建实现其产品的电路具有独特的逻辑功能。

著录项

  • 来源
    《ECN》 |2005年第3期|p.45-46|共2页
  • 作者

    Per Holmberg;

  • 作者单位

    Virtex Solutions Marketing at Xilinx, 2100 Logic Drive, San Jose, CA 9524;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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