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首页> 外文期刊>Acta Materialia >INFLUENCE OF UNDERCOOLING ON SOLID/LIQUID INTERFACE MORPHOLOGY IN SEMICONDUCTORS
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INFLUENCE OF UNDERCOOLING ON SOLID/LIQUID INTERFACE MORPHOLOGY IN SEMICONDUCTORS

机译:降温对半导体中固/液界面形态的影响

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摘要

Highly pure Si and Ge were undercooled by an electromagnetic levitator combined with a laser heating unit Their crystal growth velocities were measured as a function of undercooling and the appearance of the solicon/liquid interface was observed by means of a high-speed camera. The result was compared with the predicted value based on the dendrite growth theory. The growth behavior of Si was found to be classified into three categories of lateral growth, isolated dendrite growth and closer dendrite growth at low, moderate and high undercooling values, respectively. The first transition in the classification was caused by a change in the growth mechanism frorn stepwise growth in a single plane to that in multiple planes. The second transition was observed as a flattening of the macroscopic appearance of the interface. The transition undercoolings for the classifications were l00 and 2l0 K for Si, and 85 and l70 K for Ge.
机译:高纯度的硅和锗通过与激光加热装置组合的电磁悬浮器过冷,测量了晶体生长速度与过冷的关系,并通过高速照相机观察了溶胶/液界面的出现。将结果与基于枝晶生长理论的预测值进行比较。在低,中和高过冷值下,Si的生长行为被分为三类横向生长,孤立的枝晶生长和接近的枝晶生长。分类中的第一个转变是由单平面逐步增长到多平面逐步增长的增长机制引起的。观察到第二次转变是界面宏观外观的变平。分类的过渡过冷度对于Si是100和210 K,对于Ge是85和170K。

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