EFFECTS OF LINE AND PASSIVATION GEOMETRY ON CURVATURE EVOLUTION DURING PROCESSING AND THERMAL CYCLING IN COPPER INTERCONNECT LINES

摘要

A simple theoretical analysis of curvature evolution in unpassivated and passivated copper interconnect lines on a silicon substrate is proposed. A layer consisting of copper and oxide lines is mod- eled as a homogenized composite that has different elastic moduli and thermal expansion coefficients in two different directions, i.e. along across the lines, due to the anisotropic line geometry.