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A general approach to composites containing nonmetallic fillers and liquid gallium

机译:一种含有非金属填料和液体镓的复合材料的一般方法

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We report a versatile method to make liquid metal composites by vigorously mixing gallium (Ga) with non-metallic particles of graphene oxide (G-O), graphite, diamond, and silicon carbide that display either paste or putty-like behavior depending on the volume fraction. Unlike Ga, the putty-like mixtures can be kneaded and rolled on any surface without leaving residue. By changing temperature, these materials can be stiffened, softened, and, for the G-O–containing composite, even made porous. The gallium putty (GalP) containing reduced G-O (rG-O) has excellent electromagnetic interference shielding effectiveness. GalP with diamond filler has excellent thermal conductivity and heat transfer superior to a commercial liquid metal–based thermal paste. Composites can also be formed from eutectic alloys of Ga including Ga-In (EGaIn), Ga-Sn (EGaSn), and Ga-In-Sn (EGaInSn or Galinstan). The versatility of our approach allows a variety of fillers to be incorporated in liquid metals, potentially allowing filler-specific “fit for purpose” materials.
机译:我们报告了一种多功能的方法,通过剧烈混合镓(Ga)与石墨烯氧化物(GO),石墨,金刚石和碳化硅的非金属颗粒混合镓(Ga),根据体积分数显示糊剂或腻子等行为。与Ga不同,可以在任何表面上捏合腻子混合物而不离开残留物。通过温度改变,可以加强,软化,并且用于含G-O的复合材料,甚至是多孔的这些材料。含有减少的G-O(RG-O)的镓腻子(GALP)具有优异的电磁干扰屏蔽效果。具有金刚石填料的Galp具有优异的导热性和热传递优于商业液体金属基热浆。复合材料也可以由Ga的共晶合金形成,包括Ga-In(Egain),Ga-Sn(EGAsn)和Ga-In-Sn(例如,或者GA-SN)。我们的方法的多功能性允许各种填料掺入液态金属中,可能允许填充特异性的“适合目的”材料。

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