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首页> 外文期刊>Bulletin of materials science >Characterization and electrochemical analysis of silver electrodeposition in ChCl–urea deep eutectic solvents
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Characterization and electrochemical analysis of silver electrodeposition in ChCl–urea deep eutectic solvents

机译:CHCL-尿布深沉淀溶剂中银电沉积的表征及电化学分析

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Electrochemical reduction behaviours of silver ions in ChCl–urea deep eutectic solvents (DESs) were investigated by cyclic voltammetry. The results showed that equilibrium potential $E_{m eq}$ of the electrode system in ChCl–urea DESs was $-$0.112 V. The Tafel curve was used to obtain the exchange current density $j^0 = 2.92 pm 0.2$ cm$^{-2}$ and the transfer coefficient $lpha = 0.16 pm 0.2$. The nucleation and growth mechanism of silver were studied by cyclic current method. The results showed that electrodeposition consisted of two processes, 3D nucleation with diffusion-controlled growth $j_{m 3D-dc}(t)$ and a small amount of water in the reduction $j_{m WR}(t)$. By calculating the percentage of different charge densities of $j_{m 3D-dc}$ and $j_{m WR}$, the contribution rate of different processes to the total current was analysed. With the increase in potential, the charge in water reduction process decreased, while the charge in silver 3D nucleation process increased. Scanningelectron microscope and energy spectrum scanning were used to characterize the surface and section micro-morphologies of silver coating. The results showed that silver grew dendritically at $-$0.97 V, and the thickness was 22.98 $mu$m. The results of X-ray photoelectron spectroscopy showed that silver coating was composed of Ag$_2$O and Ag.
机译:通过循环伏安法研究了CHCL-urea深度共晶溶剂(DES)中银离子的电化学减少行为。结果表明,CHCL-UREA DES中的电极系统的平衡潜在$ e_ { rm eq} $ - $ 0.112 V. TAFEL曲线用于获得交换电流密度$ J ^ 0 = 2.92 PM 0.2 $ CM $ ^ { - 2} $和传输系数$ alpha = 0.16 PM 0.2 $。通过循环电流法研究了银的成核和生长机制。结果表明,电沉积由两种过程组成,3D成核与扩散控制的增长$ J _ { rm 3D-DC}(T)$和少量的水中减少$ J _ { rm wr}(t)$ 。通过计算$ j _ { rm 3d-dc-dc} $和$ j { rm wr} $的不同电荷密度的百分比,分析了对总电流的不同进程的贡献率。随着潜力的增加,减少水减少过程的电荷降低,而银3D成核过程中的电荷增加。扫描电子显微镜和能谱扫描用于表征银涂层的表面和截面微观形态。结果表明,银色成长为$ 0.97 V,厚度为22.98 $ mu $ m。 X射线光电子能谱的结果表明,银涂层由AG $ _2 $ O和AG组成。

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