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Understanding Impedance Response Characteristics of a Piezoelectric-Based Smart Interface Subjected to Functional Degradations

机译:了解经受功能降级的压电基智能界面的阻抗响应特性

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The functionality of piezoelectric devices is of significant importance in the electromechanical impedance (EMI)-based structural health monitoring (SHM) and damage detection. Despite the previous work, the EMI response characteristics of a degraded piezoelectric-based smart interface have not been sufficiently investigated due to the difficulty in making realistic functional defects via the experiment. To overcome this issue, we present a predictive simulation strategy to comprehensively investigate the EMI response characteristics of a smart interface subjected typical functional degradations. For that, a bolted steel girder connection is selected as a host structure to experimentally conduct EMI response measurement via the smart interface. Then, a finite element (FE) model corresponding to the experimental model is established and updated to reproduce the measured EMI response. By using the updated FE model, four common degradation types, including shear lag effect, transducer debonding, transducer breakage, and interface detaching are simulated and their effects on the EMI response are comprehensively analyzed. It is found that the interface detaching defect has significant impacts on the primary resonances of the EMI response and generates additional peaks with complex modal shapes. Also, the functional defects can result in distinctive EMI response characteristics, which are promising for assessing the functional condition of the smart interface.
机译:压电器件的功能在机电阻抗(EMI)的结构健康监测(SHM)和损伤检测中具有重要意义。尽管以前的作品,由于难以通过实验制造现实的功能缺陷,但尚未充分地研究了降级的压电智能界面的EMI响应特性。为了克服这个问题,我们提出了一种预测模拟策略,以全面调查智能界面的EMI响应特征受到典型的功能降级。为此,选择螺栓钢梁连接作为主机结构,以通过智能界面通过实验进行EMI响应测量。然后,建立和更新对应于实验模型的有限元(FE)模型以再现测量的EMI响应。通过使用更新的FE模型,模拟了四种常见的劣化类型,包括剪力滞后效果,传感器剥离,传感器断裂和界面分离,并综合分析了对EMI响应的影响。发现界面分离缺陷对EMI响应的初级谐振产生显着影响,并产生具有复杂模态形状的额外峰。此外,功能缺陷可能导致独特的EMI响应特性,这是评估智能接口功能条件的有希望的。

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