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Prediction of Field Failure Rate using Data Mining in the Automotive Semiconductor

机译:使用汽车半导体中的数据挖掘预测现场故障率

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Since the 20th century, automobiles, which are the most common means of transportation, have been evolving as the use of electronic control devices and automotive semiconductors increases dramatically. Automotive semiconductors are a key component in automotive electronic control devices and are used to provide stability, efficiency of fuel use, and stability of operation to consumers. Since automotive semiconductors have a high data rate basically, a microprocessor unit is being used instead of a micro control unit. For example, semiconductors based on ARM processors are being used in telematics, audio/video multi-medias and navigation. Automotive semiconductors require characteristics such as high reliability, durability and long-term supply, considering the period of use of the automobile for more than 10 years. The reliability of automotive semiconductors is directly linked to the safety of automobiles. The semiconductor industry uses JEDEC and AEC standards to evaluate the reliability of automotive semiconductors. In addition, the life expectancy of the product is estimated at the early stage of development and at the early stage of mass production by using the reliability test method and results that are presented as standard in the automobile industry. However, there are limitations in predicting the failure rate caused by various parameters such as customer’s various conditions of use and usage time. To overcome these limitations, much research has been done in academia and industry. Among them, researches using data mining techniques have been carried out in many semiconductor fields, but application and research on automotive semiconductors have not yet been studied.In this regard, this study investigates the relationship between data generated during semiconductor assembly and package test process by using data mining technique, and uses data mining technique suitable for predicting potential failure rate using customer bad data.
机译:自20世纪以来,汽车是最常见的运输工具,一直在不断发展,因为使用电子控制装置和汽车半导体急剧增加。汽车半导体是汽车电子控制装置中的关键部件,用于提供稳定性,燃料使用效率,以及对消费者的操作稳定性。由于汽车半导体基本上具有高数据速率,因此使用微处理器单元代替微控制单元。例如,基于ARM处理器的半导体正在远程信息处理,音频/视频多媒体和导航中使用。汽车半导体需要高可靠性,耐用性和长期供应等特性,考虑到汽车的使用时间超过10年。汽车半导体的可靠性与汽车的安全直接相关。半导体行业使用JEDEC和AEC标准来评估汽车半导体的可靠性。此外,通过使用汽车行业中标​​准的可靠性测试方法和结果,在发育早期和批量生产早期阶段估计产品的预期寿命。然而,有限制预测由各种参数引起的故障率,例如客户的各种使用条件和使用时间。为了克服这些限制,在学术界和工业中已经进行了许多研究。其中,使用数据挖掘技术的研究已经在许多半导体领域进行,但是尚未研究汽车半导体的应用和研究。在这方面,本研究调查了半导体组件和封装测试过程中产生的数据之间的关系使用数据挖掘技术,并使用适用于使用客户不良数据来预测潜在故障率的数据挖掘技术。

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