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In-situ preparation of hierarchical flower-like TiO2/carbon nanostructures as fillers for polymer composites with enhanced dielectric properties

机译:原位制备等级花状TiO2 /碳纳米结构作为具有增强介电性能的聚合物复合材料的填料

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Novel three-dimensional hierarchical flower-like TiO2/carbon (TiO2/C) nanostructures were in-situ synthesized via a solvothermal method involving calcination of organic precursor under inert atmosphere. The composite films comprised of P (VDF-HFP) and as-prepared hierarchical flower-like TiO2/C were fabricated by a solution casting and hot-pressing approach. The results reveal that loading the fillers with a small amount of carbon is an effective way to improve the dielectric constant and suppress the dielectric loss. In addition, TiO2/C particles with higher carbon contents exhibit superiority in promoting the dielectric constants of composites when compared with their noncarbon counterparts. For instance, the highest dielectric constant (330.6) of the TiO2/C composites is 10 times over that of noncarbon-TiO2-filled ones at the same filler volume fraction, and 32 times over that of pristine P (VDF-HFP). The enhancement in the dielectric constant can be attributed to the formation of a large network, which is composed of local micro-capacitors with carbon particles as electrodes and TiO2 as the dielectric in between.
机译:通过涉及惰性气氛下的有机前体煅烧的溶液,新颖的三维等级花状TiO 2 /碳(TiO2 / C)纳米结构原位合成。由P(VDF-HFP)和由制备的等级花样TiO 2 / C组成的复合膜通过溶液浇铸和热压方法制造。结果表明,用少量碳加载填料是改善介电常数并抑制介电损耗的有效方法。另外,与少碳对应物相比,具有较高碳内含量较高的TiO 2 / C颗粒在促进复合材料的介电常数方面表现出优异性。例如,TiO 2 / C复合材料的最高介电常数(330.6)是在相同填充体积分数的非碳-TiO2填充物的10倍,并且在原始P(VDF-HFP)的32倍。介电常数的增强可归因于形成大型网络,其由局部微电容器与碳颗粒作为电极和TiO 2组成,作为电介质。

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