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Research on Two-Stage Joint Optimization Problem of Green Manufacturing and Maintenance for Semiconductor Wafer

机译:半导体晶圆绿色制造与维护的两阶段联合优化问题研究

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This paper proposes a two-stage joint optimization problem of green manufacturing and maintenance for semiconductor wafer (TSGMM-SW) considering manufacturing stage, inspection, and repair stage simultaneously, which is a typical NP-hard problem with practical research significance and value. Aiming at this problem, a green scheduling model with the objective of minimizing makespan, total carbon emissions, and total preventive maintenance (PM) costs is constructed, and an improved hybrid multiobjective multiverse optimization (IHMMVO) algorithm is proposed in this paper. The joint optimization of green manufacturing and maintenance is realized by designing synchronous scheduling and maintenance strategy for wafer manufacturing and equipment PM. The diversity of the population is expanded and the optimization performance of IHMMVO is improved by designing the initial population fusion strategy and subpopulation evolution strategy. In the experimental phase, we perform the simulation experiments of 900 test cases randomly generated from 90 parameter combinations. The IHMMVO algorithm is compared with other existing algorithms to verify the effectiveness and feasibility for TSGMM-SW.
机译:本文提出了考虑制造阶段,检验和修复阶段的半导体晶片(TSGMM-SW)的绿色制造和维护的两阶段联合优化问题,这是一种典型的NP难题,具有实际研究意义和价值。针对这一问题,构建了一种绿色调度模型,目的是最大限度地减少MakEspan,总碳排放和总预防性维护(PM)成本,并在本文中提出了一种改进的混合多层多方面优化(IHMMVO)算法。通过设计晶圆制造和设备PM的同步调度和维护策略来实现绿色制造和维护的联合优化。通过设计初始群体融合策略和亚疏贫进展策略,改善了人口的多样性,并且通过设计初始群体融合策略和亚贫化演变策略来改善IHMMVO的优化性能。在实验阶段,我们在90个参数组合中随机生成900个测试用例的模拟实验。将IHMMVO算法与其他现有算法进行比较,以验证TSGMM-SW的有效性和可行性。

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