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首页> 外文期刊>International Journal of Photoenergy >Efficiency and Droop Improvement in GaN-Based High-Voltage Flip Chip LEDs
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Efficiency and Droop Improvement in GaN-Based High-Voltage Flip Chip LEDs

机译:GaN基高压倒装芯片LED的效率和下垂改善

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The GaN-based high-voltage flip chip light-emitting diode (HVFC-LED) is designed and developed for the purpose of efficiency enhancement. In our design, the distributed Bragg reflector (DBR) is deposited at the bonded substrate to increase the light extraction. After the flip chip process, the general current-voltage characteristics between the flip chip sample and the traditional sample are essentially the same. With the help of great thermal conductive silicon substrate and the bottom DBR, the HVFC-LED is able to enhance the power by 37.1% when compared to the traditional high-voltage LEDs. The wall-plug efficiencies of the HVFC-LED also show good droop reduction as high as 9.9% compared to the traditional devices.
机译:设计和开发了基于GaN的高压倒装芯片发光二极管(HVFC-LED),以便提高效率。在我们的设计中,分布式布拉格反射器(DBR)沉积在粘结的基材上以增加光提取。在倒装芯片过程之后,倒装芯片样品和传统样品之间的一般电流 - 电压特性基本相同。借助于大导热硅衬底和底部DBR,与传统的高压LED相比,HVFC-LED能够在37.1%上增强功率。与传统设备相比,HVFC-LED的壁塞效率也显示出高达9.9%的良好下垂降低。

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