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Two-step breakdown of a SiN membrane for nanopore fabrication: Formation of thin portion and penetration

机译:用于纳米孔制造的SiN膜的两步分解:薄部分的形成和渗透

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For the nanopore sensing of various large molecules, such as probe-labelled DNA and antigen-antibody complexes, the nanopore size has to be customized for each target molecule. The recently developed nanopore fabrication method utilizing dielectric breakdown of a membrane is simple and quite inexpensive, but it is somewhat unsuitable for the stable fabrication of a single large nanopore due to the risk of generating multiple nanopores. To overcome this bottleneck, we propose a new technique called “two-step breakdown” (TSB). In the first step of TSB, a local conductive thin portion (not a nanopore) is formed in the membrane by dielectric breakdown. In the second step, the created thin portion is penetrated by voltage pulses whose polarity is opposite to the polarity of the voltage used in the first step. By applying TSB to a 20-nm-thick SiN membrane, a single nanopore with a diameter of 21–26?nm could be fabricated with a high yield of 83%.
机译:为了对各种大分子(例如探针标记的DNA和抗原-抗体复合物)进行纳米孔感测,必须为每个目标分子定制纳米孔大小。最近开发的利用膜的介电击穿的纳米孔制造方法是简单且相当便宜的,但是由于产生多个纳米孔的风险,它在某种程度上不适于稳定地制造单个大纳米孔。为克服此瓶颈,我们提出了一种称为“两步故障”(TSB)的新技术。在TSB的第一步中,通过电介质击穿在膜中形成局部导电薄层(不是纳米孔)。在第二步骤中,所产生的薄部分被电压脉冲穿透,该电压脉冲的极性与第一步中使用的电压的极性相反。通过将TSB应用于厚度为20 nm的SiN膜,可以以83%的高产率制备直径为21–26?nm的单个纳米孔。

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