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Can We Build a Truly High Performance Computer Which is Flexible and Transparent?

机译:我们能否制造出真正灵活,透明的高性能计算机?

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State-of-the art computers need high performance transistors, which consume ultra-low power resulting in longer battery lifetime. Billions of transistors are integrated neatly using matured silicon fabrication process to maintain the performance per cost advantage. In that context, low-cost mono-crystalline bulk silicon (100) based high performance transistors are considered as the heart of today's computers. One limitation is silicon's rigidity and brittleness. Here we show a generic batch process to convert high performance silicon electronics into flexible and semi-transparent one while retaining its performance, process compatibility, integration density and cost. We demonstrate high-k/metal gate stack based p-type metal oxide semiconductor field effect transistors on 4 inch silicon fabric released from bulk silicon (100) wafers with sub-threshold swing of 80?mV dec?1 and on/off ratio of near 104 within 10% device uniformity with a minimum bending radius of 5?mm and an average transmittance of ~7% in the visible spectrum.
机译:先进的计算机需要高性能的晶体管,它们消耗超低功耗,从而延长了电池寿命。使用成熟的硅制造工艺可以整齐地集成数十亿个晶体管,以保持每单位成本的性能优势。在这种情况下,基于低成本单晶体硅(100)的高性能晶体管被视为当今计算机的心脏。局限性之一是硅的刚性和脆性。在这里,我们展示了一种通用的批处理过程,可以将高性能硅电子产品转换为柔性半透明的电子产品,同时保留其性能,工艺兼容性,集成密度和成本。我们演示了从散装硅(100)晶片释放的4英寸硅织物上的基于高k /金属栅堆叠的p型金属氧化物半导体场效应晶体管,其亚阈值摆幅为80?mV dec ?1 和开/关比接近10 4 在10%的设备均匀度内,最小弯曲半径为5?mm,在可见光谱中的平均透射率为〜7%。

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