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APS -APS March Meeting 2017 - Event - Thermoelectric Transport Across Graphene/Hexagonal Boron Nitride/Graphene Heterostructures

机译:APS -APS 2017年3月会议-活动-跨石墨烯/六方氮化硼/石墨烯异质结构的热电传输

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We report thermoelectric transport measurements across a graphene/hexagonal boron nitride (h-BN)/graphene heterostructure device. Using an AC lock-in technique, we are able to separate the thermoelectric contribution to the I--V characteristics of these important device structures. The temperature gradient is measured optically using Raman spectroscopy, which enables us to explore thermoelectric transport produced at material interfaces, across length scales of just 1--2 nm. Based on the observed thermoelectric voltage ($Delta $V) and temperature gradient ($Delta $T), a Seebeck coefficient of --99.3 $mu $V/K is ascertained for the heterostructure device. The obtained Seebeck coefficient can be useful for understanding the thermoelectric component in the cross-plane I--V behaviors of emerging 2D heterostructure devices. These results provide an approach to probing thermoelectric energy conversion in two-dimensional layered heterostructures.
机译:我们报告了跨石墨烯/六方氮化硼(h-BN)/石墨烯异质结构器件的热电传输测量。使用AC锁定技术,我们能够分离出热电对这些重要器件结构的I-V特性的贡献。温度梯度是使用拉曼光谱法光学测量的,这使我们能够探索在材料界面产生的热电传输,长度范围仅为1--2 nm。根据观察到的热电电压($ Delta $ V)和温度梯度($ Delta $ T),确定异质结构器件的塞贝克系数为-99.3 $ mu $ V / K。获得的塞贝克系数对于理解新兴的2D异质结构器件的横断面I-V行为中的热电成分很有用。这些结果提供了一种探索二维分层异质结构中热电能量转化的方法。

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