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Preparation and characterization of sodium thiosulfate pentahydrate/silica microencapsulated phase change material for thermal energy storage

机译:五水硫代硫酸钠/二氧化硅微囊化相变材料的制备与表征

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Microencapsulated phase change materials (MicroPCM) were successfully fabricated by encapsulation of sodium thiosulfate pentahydrate (SoTP) as core with silica shell using sol–gel method. The chemical structure, phase analysis, surface morphology, thermal properties and thermal stability of the MicroPCM were tested using X-ray diffraction instrument (XRD), X-ray photoelectron spectroscopy (XPS), energy dispersive X-ray spectroscopy (EDX), Fourier-transform infrared spectroscopy (FTIR), scanning electron microscopy (SEM), transmission electron microscopy (TEM), differential scanning calorimetry (DSC) and thermogravimetric analyzer (TG), respectively. The effects of core/shell mass ratio, concentration of emulsifier and stirring rate on the morphology of MicroPCM were studied. In addition, the core/shell mass ratio impact on the latent heat, thermal stability and supercooling of MicroPCM were also tested. The results indicates that the MicroPCM have relatively spherical shape. The encapsulation ratio of MicroPCM decrease with the decrease of SoTP mass percentage. The thermal properties and supercooling degree have been greatly improved. The highest encapsulation ratio of the MicroPCM is 94.65%. The thermal conductivity of SoTP is improved from 0.6035 to 0.7718 W (m k)?1 after the encapsulation of SoTP with silica. Depending on all results, it can be concludes that the prepared SoTP/silica MicroPCM have great potential for being used in thermal energy storage applications.
机译:微囊化相变材料(MicroPCM)是通过使用溶胶-凝胶法将硫代硫酸钠五水合物(SoTP)包裹在硅壳中而成功制成的。使用X射线衍射仪(XRD),X射线光电子能谱(XPS),能量色散X射线能谱(EDX),傅里叶(Fourier)对MicroPCM的化学结构,相分析,表面形态,热性质和热稳定性进行了测试-变换红外光谱(FTIR),扫描电子显微镜(SEM),透射电子显微镜(TEM),差示扫描量热法(DSC)和热重分析仪(TG)。研究了核/壳质量比,乳化剂浓度和搅拌速率对MicroPCM形貌的影响。此外,还测试了核/壳质量比对MicroPCM的潜热,热稳定性和过冷的影响。结果表明MicroPCM具有相对球形。随着SoTP质量百分比的降低,MicroPCM的封装率降低。热性能和过冷度已大大提高。 MicroPCM的最高封装率为94.65%。用二氧化硅包封后,SoTP的导热系数从0.6035提高到0.7718 W(m k) ?1 。根据所有结果,可以得出结论,制备的SoTP /二氧化硅MicroPCM具有巨大的潜力,可用于热能存储应用。

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