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Enhanced hole injection in organic light-emitting diodes utilizing a copper iodide-doped hole injection layer

机译:利用掺杂碘化铜的空穴注入层增强有机发光二极管中的空穴注入

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We have demonstrated organic light-emitting diodes (OLEDs) by incorporating copper iodide (CuI) in 4,4′,4′′-tris(N-3-methylphenyl-N-phenyl-amino)triphenylamine (m-MTDATA) as a hole injection layer (HIL) based on the emitting system of C545T–Alq3. The device with CuI-doped m-MTDATA HIL shows a very low operating voltage of about 4.26 and 5.70 V for 1000 and 10?000 cd m?2, respectively, which reveals a great improvement over the undoped device m-MTDATA HIL (4.85 V for 1000 cd m?2 and 7.72 V for 10?000 cd m?2). Furthermore, the CuI-doped device exhibits a maximum power efficiency of 5.88 lm W?1, about 58% higher than that of the corresponding undoped device (3.71 lm W?1). The improved performance of the CuI-doped device could be attributed to the enhanced hole injection and transport due to the generation of free charge carriers in the CuI-doped layer by charge transfer from m-MTDATA to CuI molecules, leading to an increase in electrical conductivity and formation of ohmic contact at the ITO/HIL interface.
机译:我们已经通过在4,4',4''-tris( N -3-甲基苯基- N 中掺入碘化铜(CuI)展示了有机发光二极管(OLED) >-苯基-氨基)三苯胺( m -MTDATA)作为基于C545T–Alq 3 。具有CuI掺杂的 m -MTDATA HIL的器件在1000和10?000 cd m ?2 <时显示出非常低的工作电压,约为4.26和5.70 V / small>,与未掺杂的设备 m -MTDATA HIL相比,它有了很大的改进(对于1000 cd m ?2 和10,000 cd m ?2 的电压为7.72 V)。此外,CuI掺杂器件的最大功率效率为5.88 lm W ?1 ,比相应的未掺杂器件(3.71 lm W ?1 )。掺杂CuI的器件性能的提高归因于空穴注入和传输的增强,这是由于通过 m -MTDATA电荷转移到CuI分子在CuI掺杂层中生成了自由电荷载流子导致电导率增加,并在ITO / HIL界面形成欧姆接触。

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