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首页> 外文期刊>MATEC Web of Conferences >Degradation of Alumina and Magnesia Chrome refractory bricks in Portland cement kiln – Corrected version
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Degradation of Alumina and Magnesia Chrome refractory bricks in Portland cement kiln – Corrected version

机译:波特兰水泥窑中氧化铝和氧化镁铬耐火砖的降解–修正版本

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摘要

In cement plants, the refractory products are particularly confronted to partially liquid oxide phases at temperature ranging between 900°C and 1700°C. All constituents of these products have to resist not only to thermal constraints, but also to the thermochemical solicitations which result from contact material/coating. In order to study the phenomenon of degradation of refractory bricks in cement kilns and to identify the causes of their degradation, we proceed to the examination of industrial cases in cement kiln. Many chemical tests of the degraded refractory bricks have been done and the results acquired were compared to the ones not used. The analysis of the results is doing using different techniques (Loss of ignition, X-ray Fluorescence, X-ray Diffraction). The results show that the degradation of the used bricks in the clinkering and cooling zone is due to the infiltration of aggressive elements such us sulphur, alkali (Na2O, K2O ...). The chemical interaction between the Portland clinker phases and refractory material has also an importance on the stability of the coating and consequently on the life of the refractories.* This corrected version replaces the article Degradation of Alumina and Magnesia Chrome refractory bricks in Portland cement kiln, MATEC Web of Conferences 11 01015 (2014), DOI: 10.1051/matecconf/20141101015, which has been formally withdrawn.
机译:在水泥厂中,耐火产品在900°C至1700°C的温度范围内特别面对部分液态的氧化物相。这些产品的所有成分不仅必须抵抗热限制,而且还要抵抗接触材料/涂层引起的热化学吸引。为了研究耐火砖在水泥窑中的降解现象并找出其降解原因,我们着手对水泥窑的工业案例进行研究。已经对降解的耐火砖进行了许多化学测试,并将获得的结果与未使用的进行了比较。使用不同的技术(点火损耗,X射线荧光,X射线衍射)对结果进行分析。结果表明,在熟料和冷却区中使用过的砖的降解归因于侵蚀性元素的渗透,例如硫,碱(Na2O,K2O ...)。波特兰熟料相与耐火材料之间的化学相互作用也对涂料的稳定性以及因此耐火材料的寿命具有重要意义。*此更正的版本取代了波特兰水泥窑中氧化铝和氧化镁铬耐火砖的降解, MATEC会议网络11 01015(2014),DOI:10.1051 / matecconf / 20141101015,已正式撤回。

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