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Comparison of Methods for Evaluation of the Bactericidal Activity of Copper-Sputtered Surfaces against Methicillin-Resistant Staphylococcus aureus

机译:铜溅射表面对耐甲氧西林金黄色葡萄球菌杀菌活性评估方法的比较

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Bacteria can survive on hospital textiles and surfaces, from which they can be disseminated, representing a source of health care-associated infections (HCAIs). Surfaces containing copper (Cu), which is known for its bactericidal properties, could be an efficient way to lower the burden of potential pathogens. The antimicrobial activity of Cu-sputtered polyester surfaces, obtained by direct-current magnetron sputtering (DCMS), against methicillin-resistant Staphylococcus aureus (MRSA) was tested. The Cu-polyester microstructure was characterized by high-resolution transmission electron microscopy to determine the microstructure of the Cu nanoparticles and by profilometry to assess the thickness of the layers. Sputtering at 300 mA for 160 s led to a Cu film thickness of 20 nm (100 Cu layers) containing 0.209% (wt/wt) polyester. The viability of MRSA strain ATCC 43300 on Cu-sputtered polyester was evaluated by four methods: (i) mechanical detachment, (ii) microcalorimetry, (iii) direct transfer onto plates, and (iv) stereomicroscopy. The low efficacy of mechanical detachment impeded bacterial viability estimations. Microcalorimetry provided only semiquantitative results. Direct transfer onto plates and stereomicroscopy seemed to be the most suitable methods to evaluate the bacterial inactivation potential of Cu-sputtered polyester surfaces, since they presented the least experimental bias. Cu-polyester samples sputtered for 160 s by DCMS were further tested against 10 clinical MRSA isolates and showed a high level of bactericidal activity, with a 4-log10 reduction in the initial MRSA load (106 CFU) within 1 h. Cu-sputtered polyester surfaces might be of use to prevent the transmission of HCAI pathogens.
机译:细菌可以在医院的纺织品和表面上存活下来,并可以从中传播,这代表了与卫生保健相关的感染(HCAI)。以其杀菌特性而闻名的含铜(Cu)表面可能是减轻潜在病原体负担的有效方法。测试了通过直流磁控溅射(DCMS)获得的铜溅射聚酯表面对耐甲氧西林的金黄色葡萄球菌(MRSA)的抗菌活性。通过高分辨率透射电子显微镜确定Cu-纳米颗粒的微观结构,并通过轮廓测定法评估层的厚度,表征了Cu-聚酯的微观结构。以300 mA的电流溅射160 s会形成20 nm的铜膜厚度(100个铜层),其中包含0.209%(wt / wt)的聚酯。通过四种方法评估了MRSA菌株ATCC 43300在溅射铜的聚酯上的生存力:(i)机械分离,(ii)微量热法,(iii)直接转移到板上和(iv)立体显微镜。机械分离的低效率阻碍了细菌生存力的估计。微量量热法仅提供半定量结果。直接转移到平板和立体显微镜上似乎是评估铜溅射聚酯表面细菌灭活潜力的最合适方法,因为它们呈现出最小的实验偏差。通过DCMS溅射160 s的铜-聚酯样品进一步针对10种临床MRSA分离物进行了测试,并显示出高水平的杀菌活性,初始MRSA载量减少了4-log 10 (10 6 CFU)在1小时内。铜溅射的聚酯表面可能用于防止HCAI病原体的传播。

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