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Polarographic Studies on the Kinetics of Cu()-thiocyanate and the Adsorption Wave of Cu()-thiocyanate

机译:极谱法研究硫氰酸铜(Cu)的动力学和对硫氰酸铜的吸附波

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In the presence of hydrogen peroxide, the effects of temperature and pH to the catalytic reaction velocity of cupric-thiocyanate and the quantities of reduction products adsorbed on the D.M.E. have been studied by polarographic method. According to these experiments, the following empirical equation has been derived for the relation among temperature Ti, concentration of hydrogen ion pHj and adsorbed cuprous-thiocyanate in moles/cm2 Zij, and the rate constant log Kij log Kij=(1/Ti){A(pHj)£?B}£? C(pHj)£?DZij=(1/Ti){¥á(pHj)1/2£?¥a}£?¥?(pHj)1/2£?¥?where, A,B,C,D and ¥á,¥a,¥?,¥? are constants. The Calculated values by both equations are well agreed with empirical values within 8% in the error.
机译:在过氧化氢的存在下,温度和pH值对硫氰酸铜催化反应速度的影响以及D.M.E.上吸附的还原产物的数量。已经通过极谱法进行了研究。根据这些实验,针对温度Ti,氢离子pHj浓度和吸附的硫氰酸亚铜吸附摩尔数/ cm2 Zij和速率常数log Kij log Kij =(1 / Ti){ A(pHj)£?B} £? C(pHj)£ DZij =(1 / Ti){¥á(pHj)1/2 £?a} £?¥?(pHj)1/2 £?和¥á,¥ a,¥?,¥?是常数。这两个方程的计算值与误差在8%之内的经验值非常吻合。

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