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首页> 外文期刊>Journal of the Korean Institute of Electromagnetic Engineering and Science >Front-to-Back Ratio Improvement of a Microstrip Patch Antenna Loaded with Soft Surface Structure in a Partially Removed Ground Plane
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Front-to-Back Ratio Improvement of a Microstrip Patch Antenna Loaded with Soft Surface Structure in a Partially Removed Ground Plane

机译:在部分移除的地平面中加载软表面结构的微带贴片天线的前后比率改进

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This study presents a new, simple method for improving the front-to-back (F/B) ratio of a microstrip patch antenna. The back radiation of the microstrip patch antenna is reduced by removing some metallic parts around the ground plane and placing a new soft-surface configuration, consisting of an array of stand-up split-ring resonators on a bare dielectric substrate near the two ground plane edges. Compared to the F/B ratio of a conventional microstrip patch antenna with a full ground plane of the same size, our proposed microstrip patch antenna experimentally achieves an improved F/B ratio of 9.6 dB.
机译:这项研究提出了一种新的简单方法,用于改善微带贴片天线的前后(F / B)比。通过去除接地平面周围的一些金属部分并放置新的软表面配置(包括在两个接地平面附近的裸介电基板上的直立开口环谐振器阵列组成),可以减少微带贴片天线的反向辐射边缘。与具有相同大小的完整接地平面的常规微带贴片天线的F / B比相比,我们提出的微带贴片天线在实验上实现了9.6 dB的改进F / B比。

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