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首页> 外文期刊>Journal of the Ceramic Society of Japan >Influence of joining time and temperature on the flexural strength of joined boron carbide ceramics
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Influence of joining time and temperature on the flexural strength of joined boron carbide ceramics

机译:连接时间和温度对连接碳化硼陶瓷抗弯强度的影响

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摘要

The influence of the joining time and temperature on the flexural strength of B4C ceramics joined using an Al sheet was investigated. The B4C ceramics were joined over a temperature range 600–1400°C for 2–72 h in vacuum (10?2–10?4 Pa) and in an Ar atmosphere. A joining interlayer with a dense structure was found in the B4C joint formed at 1000°C after 2 h in vacuum, and mainly Al was present in this joining interlayer. On the other hand, some voids existed in the joining interlayer in the B4C joint formed after 72 h. In addition, Al was not present in this interlayer owing to its reaction with B4C as well as the evaporation of Al. Four-point bending tests of the B4C joints formed at 1000°C in vacuum for periods ranging from 2 to 72 h were performed at room temperature. The average four-point bending strengths of the B4C joints formed after 2 h at 700–1100°C were close to that of the B4C base material, and the B4C ceramics were considered to have successfully bonded. However, the joint strength decreased with an increase in the joining time, and the B4C ceramics did not bond at temperatures over 1200°C in vacuum. On the other hand, the B4C ceramics did bond at 1200–1400°C in Ar.
机译:研究了连接时间和温度对铝薄板连接B 4 C陶瓷抗弯强度的影响。将B 4 C陶瓷在600–1400°C的温度范围内真空接合2–72小时(10 ?2 –10 ?4 Pa)和Ar气氛中。在真空中放置2小时后,在1000°C形成的B 4 C接头中发现了具有致密结构的连接中间层,并且主要存在Al。另一方面,在72小时后形成的B 4 C接头的连接中间层中存在一些空隙。此外,由于该中间层与B 4 C的反应以及Al的蒸发,因此该中间层中不存在Al。在室温下,对在真空中于1000°C形成的B 4 C接头进行了2点至72小时的四点弯曲测试。在700–1100°C下2 h后形成的B 4 C接头的平均四点弯曲强度接近B 4 C基材的平均四点弯曲强度,并且B 4 C陶瓷被认为已成功粘合。但是,接合强度随着接合时间的增加而降低,并且B 4 C陶瓷在真空中在超过1200℃的温度下没有结合。另一方面,B 4 C陶瓷确实在1200-1400°C的Ar中结合。

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