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Thermal stability of ultrafine grained AA8090 Al–Li alloy processed by repetitive corrugation and straightening

机译:重复波纹和矫直处理的超细晶粒AA8090 Al-Li合金的热稳定性

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The thermal stability of an ultrafine-grained (UFG) AA8090 Al–Li alloy with an average grain size of 2μm is reported. The UFG structure was obtained by repetitive corrugation and straightening (RCS) process after 8 passes using optimized processing parameter conditions identified in the previous research, i.e., processing temperature 300°C; ram velocity 1.5mm/s using V-Grooved corrugating die profile (pitch 20mm, corrugating angle 30° and curve radius 2mm) and straightening by a flat die. The grain size distribution ranged from 200nm to 8μm. The average hardness of the RCS processed specimen had increased to a mean value of 104HV from an average value of 75HV in the parent material. The RCS processed specimens were annealed at different temperatures (T) for varying time periods (t) to investigate their thermal stability using hardness and microstructure changes as the quantitative measures. The microstructure analysis of the samples was done using electron backscattered diffraction (EBSD) analysis. The study was based on a full factorial design of experiments (DOE) and the results were analyzed using a TOPSIS optimization tool. The results prove that thermal stability is more influenced by temperature than the time of annealing, a known result based on earlier qualitative studies on conventional materials. The study also demonstrates that the material is fairly stable up to 300°C. The activation energy for grain growth is found to be 76kJ/mol in a range where the annealing time is 2–6h and the temperature range is 200–400°C.
机译:据报道,一种平均粒径为2μm的超细晶粒(UFG)AA8090 Al-Li合金的热稳定性。 UFG结构是通过使用先前研究中确定的最佳加工参数条件(即加工温度300°C)经过8次通过重复波纹和矫直(RCS)工艺获得的。使用V型槽瓦楞模具轮廓(节距20mm,瓦楞角度30°,曲率半径2mm)并通过平模矫直,冲头速度为1.5mm / s。晶粒尺寸分布范围为200nm至8μm。经RCS处理的样品的平均硬度已从母体材料中的平均值75HV增加到平均值104HV。将经过RCS处理的试样在不同的温度(T)进行不同时间段(t)的退火处理,以硬度和微观结构变化为定量手段研究其热稳定性。样品的微观结构分析是使用电子背散射衍射(EBSD)分析进行的。该研究基于完整的因子设计实验(DOE),并使用TOPSIS优化工具对结果进行了分析。结果证明,热稳定性受温度影响的程度大于退火时间,这是基于较早对常规材料进行定性研究得出的已知结果。研究还表明,该材料在300°C的温度下仍相当稳定。发现在退火时间为2-6h,温度范围为200-400°C的范围内,晶粒生长的活化能为76kJ / mol。

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