首页> 外文期刊>Journal of Laser Micro/Nanoengineering >Fabrication of Transparent and Conductive Microdevices
【24h】

Fabrication of Transparent and Conductive Microdevices

机译:透明导电微器件的制造

获取原文
           

摘要

Microsystems and microdevices can shrink a whole laboratory into a single chip. Due to its small size, such systems are cost effective, as they require small sample sizes and analysis time. Since the silicon-based microchip cannot provide optical transparency, there is a rising interest towards glass-based microchips and their possible applications where optical transparency during the analysis pro-cedure is of high importance. Our objective is to fabricate microdevices and sensors using laser di-rect writing and thin film deposition techniques. Applying these two methods to transparent materi-als will open new avenues in microdevice production by enabling the realization of transparent and conductive platforms.
机译:微系统和微设备可以将整个实验室缩小为一个芯片。由于其体积小,此类系统具有成本效益,因为它们需要的样本量和分析时间都较小。由于硅基微芯片无法提供光学透明性,因此人们对玻璃基微芯片及其在分析过程中光学透明性非常重要的可能应用中的兴趣日益浓厚。我们的目标是使用激光直写和薄膜沉积技术制造微型设备和传感器。通过透明和导电平台的实现,将这两种方法应用于透明材料将为微器件生产开辟新途径。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号