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Modelling and Simulation of Strain Resistance of Alloys Taking into Account Barrier Effects

机译:考虑势垒效应的合金抗应变建模与仿真

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The paper proposes a model of strain resistance of alloy under high-temperature deformation. The model describes hardening of alloy due to the increase of dislocation density, as well as the barrier effect of blocking free dislocations, boundaries of grains and subgrains by dispersoids. The model also takes into account the softening processes associated with the recovery and dynamic recrystallization. The model has been tested on the rheological behavior of an Al-Mg alloy named AMg6 at temperatures of 400 and 500 ºC in the range of strain rates from 5 to 25 s-1. It was found in this temperature – strain rate range that the curve of strain resistance of the AMg6 alloy consists of several portions. First there is hardening of the material, then there is material softening, which is again replaced by hardening of the material. With the use of the electron backscatter diffraction technique and transmission electron microscopy, it was found that the main process of softening at investigated temperatures is dynamic recrystallization. The appearance of the second portion of hardening on the strain resistance curve is the inhibition of dynamic recrystallization, as well as manifestation of the barrier effect of blocking free dislocations, grain and subgrain boundaries by dispersoids.
机译:提出了高温变形下合金的应变抗力模型。该模型描述了由于位错密度增加而引起的合金硬化,以及通过弥散体阻止自由位错,晶粒和亚晶粒边界的阻挡作用。该模型还考虑了与恢复和动态再结晶相关的软化过程。该模型已经测试了名为AMg6的Al-Mg合金在400和500ºC的温度下在5至25 s -1 的应变速率范围内的流变行为。在此温度-应变速率范围内发现,AMg6合金的应变电阻曲线由几部分组成。首先是材料硬化,然后是材料软化,然后又被材料硬化所代替。利用电子背散射衍射技术和透射电子显微镜,发现在研究温度下软化的主要过程是动态重结晶。应变电阻曲线上第二部分硬化的出现是动态再结晶的抑制,以及通过弥散体阻止自由位错,晶粒和亚晶粒边界的阻挡作用的表现。

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