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Temperature Dependence of Electrical Parameters of Silicon-on-Insulator Triple Gate n-Channel Fin Field Effect Transistor

机译:绝缘体上硅三栅极n沟道鳍式场效应晶体管的电参数的温度依赖性

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摘要

In this work, the temperature dependence of electrical parameters of nanoscale SOI (silicon-on-insulator) TG (triple gate) n-FinFET (n-channel Fin field effect transistor) was investigated. Numerical device simulator was used to construct, examine, and simulate the structure in three dimensions with different models. The drain current, transconductance, threshold voltage, subthreshold swing, leakage current, drain induced barrier lowering, and on/off current ratio were studied in various biasing configurations. The temperature dependence of the main electrical parameters of a SOI TG n-FinFET was analyzed and discussed. Increased temperature led to degraded performance of some basic parameters such as subthreshold swing, transconductance, on-current, and leakage current. These results might be useful for further development of devises to strongly down-scale the manufacturing process.
机译:在这项工作中,研究了纳米级SOI(绝缘体上硅)TG(三栅极)n-FinFET(n沟道Fin场效应晶体管)的电参数与温度的关系。使用数字设备模拟器来构建,检查和模拟具有不同模型的三维结构。研究了在各种偏置配置下的漏极电流,跨导,阈值电压,亚阈值摆幅,漏电流,漏极引起的势垒降低以及开/关电流比。对SOI TG n-FinFET主要电参数的温度依赖性进行了分析和讨论。温度升高导致某些基本参数的性能下降,例如亚阈值摆幅,跨导,导通电流和泄漏电流。这些结果可能对进一步开发设计以大幅缩小制造工艺规模很有用。

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