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An investigation of the influence of phases’ removal ways on surface quality in micro milling SiCp/Al composites

机译:SiCp / Al复合材料微研磨中相去除方式对表面质量的影响研究

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摘要

SiC particle-reinforced aluminum matrix (SiCp/Al) composites are widely employed due to their outstanding performance. However, since they are composed of brittle SiC and ductile aluminum, the different removal mechanisms of the two phases may affect the surface quality in micro milling. In this paper, an experimental investigation of micro milling a kind of 45% SiCp/Al composites is presented. Using different values of the feed rate, the changes of the removal ways of the two phases are shown by 3D surface roughness and surface morphology. The results indicate that the surface roughness decreases firstly and increases later with the feed rate growing, which may be caused by the change of the removal way of the particle. A criterion for that is built. SEM pictures show that the surface is significantly coated by aluminum matrix when the feed rate is small; as the feed rate increases, the coating effect of the matrix weakens, and the removal ways of the particle changes from ductile regime machining to brittle fracture. Smaller feed rate may lead to the incompletely removing (plowing) of the Al and make the soft matrix coat the surface, while larger feed rate may result in the particle fracture, producing large numbers of cracks and damaging the surface integrity. Using suitable feed rate, the Al matrix can be removed efficiently and the SiC particle can be cut in its ductile regime. The unit of the suitable removal ways of Al matrix and SiC particle in machining process can produce a better surface.
机译:SiC颗粒增强铝基(SiCp / Al)复合材料由于其出色的性能而被广泛使用。但是,由于它们由脆性SiC和韧性铝组成,两相的不同去除机理可能会影响微铣削的表面质量。本文对45%SiCp / Al复合材料进行微铣削的实验研究进行了介绍。使用不同的进给速度值,通过3D表面粗糙度和表面形态来显示两相去除方式的变化。结果表明,随着进料速度的增加,表面粗糙度先降低后增加,这可能是由于颗粒去除方式的改变所致。建立一个标准。 SEM照片显示,当进料速度较小时,表面明显被铝基质覆盖;随着进料速度的增加,基体的涂层作用减弱,颗粒的去除方式从延性加工到脆性断裂。较小的进给速度可能导致Al的去除不完全(渗出)并使软质基质覆盖表面,而较大的进给速度可能导致颗粒破裂,产生大量裂纹并损害表面完整性。使用合适的进料速度,可以有效地去除Al基体,并且可以在其延展状态下切割SiC颗粒。机加工过程中采用适当的去除Al基体和SiC颗粒的方式可以产生更好的表面。

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