Heat dissipation enhancement of LED luminaries is of great significance to the large-scale application of LED. Luminaries-level structure improvement by the method of boring through-hole is adopted to intensify heat dissipation. Furthermore, the natural convection heat transfer process of LED luminaries is simulated by computational fluid dynamics (CFD) model before and after the structural modification. As shown by computational results, boring through-hole is beneficial to develop bottomto-top natural convection, eliminate local circumfluence, and finally form better flow pattern. Analysis based on field synergy principle shows that boring through-hole across LED luminaries improves the synergy between flow field and temperature field, and effectively decreases the thermal resistance of luminaries-level heat dissipation structure. Under the same computational conditions, by luminaries-level structure improvement the highest temperature of heat sink is decreased by about 8° C and the average heat transfer coefficient is increased by 45.8%.
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