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Study on the Causes of the Failure of the Insulation Resistance of Molded Inductors with Soft Magnetic Materials

机译:软磁材料成型电感器绝缘电阻失效的原因研究

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In this paper, the cause of the insulation resistance of molded inductor in low temperature baking is discussed, and the method to improve the insulation resistance is found. It was found that the surface bonding force between the metal soft magnetic powder and the coating layer increased first and then decreased with the increase of temperature, and the coating layer was brittle with the increase of temperature. The results show that the change of the volume change of the coating layer and the change of the surface binding force between the coating layer material in the curing process, and the higher the degree of curing the coating layer is brittle, and the interaction between the two and the coating layer can produce the peeling or even fall off.
机译:本文探讨了成型电感在低温烘烤过程中绝缘电阻的原因,并找到了提高绝缘电阻的方法。发现随着温度的升高,金属软磁性粉末与涂层之间的表面结合力先升高后降低,涂层的脆性随温度升高而变脆。结果表明,在固化过程中,涂层的体积变化和涂层材料之间的表面结合力的变化是变化的,并且固化程度越高,涂层的脆性就越大。二,涂层会产生剥离甚至脱落。

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