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首页> 外文期刊>Leonardo Electronic Journal of Practices and Technologies >Design and analysis of microstrip slot array configurations for bandwidth enhancement
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Design and analysis of microstrip slot array configurations for bandwidth enhancement

机译:设计和分析微带插槽阵列配置,以提高带宽

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A bandwidth-enhanced Microstrip slotted array antenna is fabricated on an electrically-thin substrate to provide an economical solution for communication applications. To improve the impedance bandwidth of a rectangular micro strip patch without having any impact on its radiation characteristics, we perform etching of straight slot which is parallel and near to top side of the patch. For demonstrating the usefulness of the suggested technique, a planar array of dimension 6X6 with a side-lobe of 25 dB in both the E and H-planes are studied and fabricated on the FR4 substrate with 0.787 mm thickness. Simulation studies will be carried out on Method of Moments based EM Tool and analysis of the model is done by changing different operational parameters like the width of the slot, array element spacing, and array pattern. The antenna output parameters will be studied by changing substrate materials, εr ranging from 2 to 4.4 and complete analysis is presented in a detailed manner.
机译:在电薄基板上制造带宽增强的微带缝隙阵列天线,为通信应用提供经济的解决方案。为了提高矩形微带贴片的阻抗带宽而又不影响其辐射特性,我们对平行于贴片顶面并靠近贴片顶面的直缝进行蚀刻。为了证明所建议技术的实用性,研究了尺寸为6X6的平面阵列,该平面阵列在E和H平面上的旁瓣均为25 dB,并在厚度为0.787 mm的FR4基板上制造。将在基于矩量法的EM Tool上进行仿真研究,并通过更改不同的操作参数(例如槽的宽度,阵列元件间距和阵列图案)来进行模型分析。天线输出参数将通过改变基板材料来研究,εr在2到4.4之间,并以详细的方式给出完整的分析。

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