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Microstructural evolution and physical properties of lead-tin alloys synthesized by melt-spinning technique

机译:熔融纺丝法合成铅锡合金的组织演变和物理性能

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摘要

Lead-tin alloy is frequently used to joint electronic components in electronic packaging and it is a based whitemetalwhich has excellent properties for the majority of internal combustion engines, such as crankshaft bearing linings in slow-speedmarine diesel engines.By usingX-ray diffraction (XRD), transmission electron microscopy (TEM), double bridge method and dynamic resonance technique, microstructure, electrical resistivity, temperature coefficient of resistivity (T.C.R), lattice parameter, crystal size and elastic modulus of Pb-Sn rapidly solidified alloys were investigated. Electrical resistivity, T.C.R, lattice parameter and crystal size of lead- tin alloy is decreased by increasing tin amounts in it but elastic modulus is increased. Tin- 3%lead rapidly solidified alloy have better electrical andmechanical properties with adequate melting point as solder alloy for electronic industrial applications. But lead- 5% tin is the better based alloy for bearing applications.
机译:铅锡合金通常用于连接电子包装中的电子部件,它是一种基础的白色金属,对大多数内燃机(例如慢速船用柴油机的曲轴轴承衬里)具有优异的性能.X射线衍射(XRD) ),透射电镜(TEM),双桥法和动态共振技术,显微组织,电阻率,电阻率温度系数(TCR),晶格参数,Pb-Sn快速凝固合金的晶体尺寸和弹性模量。铅锡合金的电阻率,T.C.R,晶格参数和晶体尺寸通过增加锡含量而降低,但弹性模量增加。锡含量为3%的快速凝固合金具有良好的电气和机械性能,并且具有足够的熔点,可作为电子工业应用的焊料合金。但是5%铅锡是轴承应用中更好的基础合金。

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