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Stabilizing nanoprecipitates in Al-Cu alloys for creep resistance at 300°C

机译:在300°C下稳定Al-Cu合金中的纳米沉淀物的抗蠕变性

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Commercial precipitation-hardened Al-Cu alloys are normally used at temperatures below its ageing temperature of ~225°C, to avoid thermally induced precipitate coarsening and resultant softening. Making such popular Al alloys creep resistant at or above 300°C is thus challenging. Here we present a modified precipitation protocol, exploiting Sc-microalloying and a carefully designed three-step heat treatment to enhance Sc segregation at the matrix/θ′- Al_(2)Cu precipitate interfaces. The stabilized nanoprecipitates enable an order-of-magnitude reduction in creep rate at 300°C, demonstrating the room for microstructure improvement and the potential for property elevation in traditional engineering alloys through innovative processing coupled with synergetic alloying elements.
机译:商业用沉淀硬化的Al-Cu合金通常在低于其时效温度〜约225°C的温度下使用,以避免因热引起的沉淀粗化和最终软化。因此,使这种流行的铝合金在300°C或更高的温度下具有抗蠕变性能具有挑战性。在这里,我们提出了一种改进的沉淀方案,利用Sc微合金化和精心设计的三步热处理来增强基质/ i''-Al_(2)Cu沉淀界面处的Sc偏析。稳定的纳米沉淀物可以在300°C下将蠕变速率降低一个数量级,这证明了通过创新工艺与协同合金元素相结合,传统工程合金的微观结构改善的空间和提高性能的潜力。

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