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Stochastic Numerical Simulation for the Evaluation of Mechanical Properties of Filled Polymer Composites

机译:填充聚合物复合材料力学性能评估的随机数值模拟

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摘要

Reinforced polymeric composites are profoundly used in variety of applications due to its high strength to weight ratio and ease of fabrication. The wide spread application of reinforced polymeric materials in the electronic industries have created a great demand in fabricating a kind of reinforced polymeric system, which is light but has better mechanical strength and good thermal properties. Especially glass microsphere filled epoxy resin composites is used as a potting compound in electronic and aviation industries. Therefore knowledge of the fundamental thermal and mechanical properties of these systems is highly essential in the formulation of advanced electronic potting compounds. In this work, the effective mechancial properties of glass microsphere filled epoxy system is investigated numerically by stochastic simulation. Numerical simulation software ANSYS is used to characterise the microstructure of the filled epoxy system. MATLAB code has been developed to model the randomness of the particle. The geometric model generated from the MATLAb code is given as an input to ANSYS. Random particle Representative Volume Element (RVE) model is used to evaluate the mechanical properties at various loading fractions. The effect of particle size on mechanical? properties of glass microsphere filled epoxy composite is studied. Further the random RVE modeling scheme is compared with single RVE modeling scheme and its significance is reported. The numerically predicted values of effective modulus is then compared with the analytical models and with the literature experimental data. Also the significance of the analytical? model on the determination of properties is reported. Then, the effect of interface on the mechanical characterisation by stochastic model is analysed and the debonding of the particle is also simulated.DOI: http://dx.doi.org/10.5755/j01.ms.23.1.14217
机译:增强的聚合物复合材料因其高的强度重量比和易于制造而广泛用于各种应用中。增强聚合物材料在电子工业中的广泛应用对制造一种重量轻但具有更好的机械强度和良好的热性能的增强聚合物系统提出了很高的要求。特别是玻璃微球填充的环氧树脂复合材料在电子和航空工业中用作灌封料。因此,在配制高级电子灌封胶时,对这些系统的基本热和机械性能的了解至关重要。在这项工作中,通过随机模拟数值研究了玻璃微球填充环氧体系的有效力学性能。数值模拟软件ANSYS用于表征填充环氧树脂系统的微观结构。已经开发出MATLAB代码来模拟粒子的随机性。由MATLAb代码生成的几何模型作为ANSYS的输入给出。随机粒子代表体积元素(RVE)模型用于评估各种载荷分数下的机械性能。粒度对机械的影响?研究了玻璃微球填充环氧复合材料的性能。此外,将随机RVE建模方案与单个RVE建模方案进行了比较,并报告了其重要性。然后将有效模量的数值预测值与分析模型和文献实验数据进行比较。还有分析的意义吗?报告了确定性质的模型。然后,分析了界面对随机模型力学表征的影响,并模拟了颗粒的脱粘.DOI:http://dx.doi.org/10.5755/j01.ms.23.1.14217

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