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Effects of Annealing Temperature on Properties of Ti-Ga–Doped ZnO Films Deposited on Flexible Substrates

机译:退火温度对柔性衬底上掺杂Ti-Ga的ZnO薄膜性能的影响

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An investigation is performed into the optical, electrical, and microstructural properties of Ti-Ga–doped ZnO films deposited on polyimide (PI) flexible substrates and then annealed at temperatures of 300 °C, 400 °C, and 450 °C, respectively. The X-ray diffraction (XRD) analysis results show that all of the films have a strong (002) Ga doped ZnO (GZO) preferential orientation. As the annealing temperature is increased to 400 °C, the optical transmittance increases and the electrical resistivity decreases. However, as the temperature is further increased to 450 °C, the transmittance reduces and the resistivity increases due to a carbonization of the PI substrate. Finally, the crystallinity of the ZnO film improves with an increasing annealing temperature only up to 400 °C and is accompanied by a smaller crystallite size and a lower surface roughness.
机译:对沉积在聚酰亚胺(PI)柔性基板上,然后分别在300°C,400°C和450°C的温度下进行Ti-Ga掺杂的ZnO膜的光学,电学和微观结构性质进行了研究。 X射线衍射(XRD)分析结果表明,所有薄膜均具有强(002)Ga掺杂的ZnO(GZO)优先取向。随着退火温度增加到400°C,透光率增加,电阻率降低。然而,随着温度进一步升高到450℃,由于PI基板的碳化,透射率降低并且电阻率增加。最后,ZnO薄膜的结晶度仅随着退火温度的升高而提高,直至最高400°C,并且伴有较小的微晶尺寸和较低的表面粗糙度。

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