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Effect of Holding Time on the Diffusion Behavior at Interface of Dissimilar Metals Joint between Aluminum and Carbon Steel Joint Using Element Promoter

机译:元素促进剂对保温时间对铝碳钢接头异种金属接头界面扩散行为的影响

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Holding time is used for optimizing the bond diffusion between aluminum Al and Carbon steel SS400. The objective of this research was to investigate the effects of holding time on the interface reactions of diffusion welding between aluminum and carbon steel. Holding time variations of 10, 15, 30 and 45 minutes were applied at 950°C using mixture of Cu and Fe powder as elements promoter. Single lap joint configuration was performed in vacum furnace to join the dissimilar materials which allowed bonding diffusion. Microstructure was examined on the same test piece. It was found that during diffusion process at 950°C, the interfacial zone between aluminum and carbon steel substrate features intermetallic layers. The intermetallic thickness increased with increasing the holding time. Crack or incomplete bonding appeared on the specimens with holding time up to 30 minutes and didn’t appear on the specimens with holding time of 45 minutes. Cu rich-element promoter made diffusion penetrated deeper than Fe rich-element promoter in the same holding time. Macrostructure, microstructure and SEM examinations revealed that Al-steel joint had the best result with element promoter content of 60/40 % at 45 minutes holding time. There was no interlayer gap at this specimen. Additionally, from mapping view it can be suggested that in terms of poor interface bonding, Cu molecules were located just around the interface area, on the other hand, in case of strong interface bonding, Cu molecules are scattered throughout the specimen. In fact, the position of Cu molecules can be used as a promising marker for the detection of quality of diffusion joint.
机译:保持时间用于优化铝铝和碳钢SS400之间的键扩散。这项研究的目的是研究保温时间对铝和碳钢之间扩散焊接的界面反应的影响。使用铜和铁粉的混合物作为元素促进剂,在950°C施加10、15、30和45分钟的保温时间。在真空炉中进行单搭接接头配置,以连接异种材料,从而允许键扩散。在同一试件上检查了微结构。发现在950℃的扩散过程中,铝和碳钢基底之间的界面区域具有金属间层。金属间厚度随着保持时间的增加而增加。保持时间长达30分钟时,试样上出现裂纹或不完全粘结,而保持时间为45分钟时,试样上未出现裂纹或不完全粘结。在相同的保持时间下,Cu富元素促进剂使扩散比Fe富元素促进剂更深地渗透。宏观结构,微观结构和SEM检查表明,在45分钟的保温时间内,铝-钢接头的效果最好,元素促进剂含量为60/40%。该样品没有层间间隙。另外,从映射的观点来看,可以认为就界面键合不良而言,Cu分子恰好位于界面区域周围,另一方面,如果界面键合牢固,则Cu分子会散布在整个样品中。实际上,铜分子的位置可以用作检测扩散接头质量的有前途的标记。

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