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首页> 外文期刊>Mathematical Problems in Engineering: Theory, Methods and Applications >Adhesion Dynamics in Probing Micro- and Nanoscale Thin Solid Films
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Adhesion Dynamics in Probing Micro- and Nanoscale Thin Solid Films

机译:探测微米和纳米级固体薄膜的粘合动力学

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摘要

This study focuses on modeling the probe dynamics in scratching and indenting thin solid films at micro- and nanoscales. The model identifies bifurcation conditions that define the stick-slip oscillation patterns of the tip. It is found that the local energy fluctuations as a function of the inelastic deformation, defect formation, material properties, and contact parameters determine the oscillation behavior. The transient variation of the localized function makes the response nonlinear at the adhesion junction. By quantifying the relation between the bifurcation parameters and the oscillation behavior, this model gives a realistic representation of the complex adhesion dynamics. Specifically, the model establishes the link between the stick-slip behavior and the inelastic deformation and the local potentials. This model justifies the experimental observations and the molecular dynamics simulation of the adhesion and friction dynamics in both the micro- and nanoscale contact.
机译:这项研究的重点是在微观和纳米尺度上对固体薄膜的划痕和压痕中的探针动力学建模。该模型确定了定义尖端的粘滑振荡模式的分叉条件。已发现,局部能量波动是非弹性变形,缺陷形成,材料特性和接触参数的函数,它决定了振荡行为。局部函数的瞬态变化使响应在粘合点处呈非线性。通过量化分叉参数和振动行为之间的关系,该模型给出了复杂粘附动力学的真实表示。具体来说,该模型建立了粘滑行为与非弹性变形和局部电势之间的联系。该模型证明了微观和纳米级接触中粘附和摩擦动力学的实验观察和分子动力学模拟是正确的。

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