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Mechanical Properties of Cu2O Thin Films by Nanoindentation

机译:纳米压痕法研究Cu 2 O薄膜的力学性能

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In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and nanoindentation techniques. The Cu2O thin films are deposited on the glass substrates with the various growth temperatures of 150, 250 and 350 °C by using radio frequency magnetron sputtering. The XRD results show that Cu2O thin films are predominant (111)-oriented, indicating a well ordered microstructure. In addition, the hardness and Young’s modulus of Cu2O thin films are measured by using a Berkovich nanoindenter operated with the continuous contact stiffness measurements (CSM) option. Results indicated that the hardness and Young’s modulus of Cu2O thin films decreased as the growth temperature increased from 150 to 350 °C. Furthermore, the relationship between the hardness and films grain size appears to closely follow the Hall-Petch equation.
机译:通过X射线衍射(XRD),原子力显微镜(AFM),扫描电子显微镜(SEM)和纳米压痕技术研究了Cu 2 O薄膜的结构和纳米力学性能。通过使用射频磁控溅射在不同的生长温度分别为150、250和350℃的条件下,在玻璃基板上沉积Cu 2 O薄膜。 XRD结果表明Cu 2 O薄膜主要是(111)取向的,表明其微观结构良好。另外,Cu 2 O薄膜的硬度和杨氏模量是通过使用带有连续接触刚度测量(CSM)选项的Berkovich纳米压头来测量的。结果表明,Cu 2 O薄膜的硬度和杨氏模量随着生长温度从150°C升高到350°C而降低。此外,硬度和薄膜晶粒尺寸之间的关系似乎紧密遵循霍尔-帕奇方程。

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