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Mechanical Properties of Cu2O Thin Films by Nanoindentation

机译:纳米压痕法制备Cu2O薄膜的力学性能

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摘要

In this study, the structural and nanomechanical properties of Cu2O thin films are investigated by X-ray diffraction (XRD), atomic force microscopy (AFM), scanning electron microscopy (SEM) and nanoindentation techniques. The Cu2O thin films are deposited on the glass substrates with the various growth temperatures of 150, 250 and 350 °C by using radio frequency magnetron sputtering. The XRD results show that Cu2O thin films are predominant (111)-oriented, indicating a well ordered microstructure. In addition, the hardness and Young’s modulus of Cu2O thin films are measured by using a Berkovich nanoindenter operated with the continuous contact stiffness measurements (CSM) option. Results indicated that the hardness and Young’s modulus of Cu2O thin films decreased as the growth temperature increased from 150 to 350 °C. Furthermore, the relationship between the hardness and films grain size appears to closely follow the Hall-Petch equation.
机译:在这项研究中,通过X射线衍射(XRD),原子力显微镜(AFM),扫描电子显微镜(SEM)和纳米压痕技术研究了Cu2O薄膜的结构和纳米机械性能。通过使用射频磁控溅射,将Cu2O薄膜以150、250和350℃的各种生长温度沉积在玻璃基板上。 XRD结果表明,Cu2O薄膜主要是(111)取向的,这表明组织结构良好。此外,使用Berkovich纳米压痕仪和连续接触刚度测量(CSM)选项可测量Cu2O薄膜的硬度和杨氏模量。结果表明,Cu2O薄膜的硬度和杨氏模量随着生长温度从150°C升高到350°C而降低。此外,硬度和薄膜晶粒尺寸之间的关系似乎紧密遵循霍尔-帕奇方程。

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