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Influence of upward and horizontal growth direction on microstructure and microhardness of an unsteady-state directionally solidified Al-Cu-Si alloy

机译:上下水平生长方向对非稳态定向凝固Al-Cu-Si合金显微组织和显微硬度的影响

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In order to analyze the effect of the growth direction on dendrite arm spacing (λ1) and microhardness (HV) during horizontal directional solidification (HDS), experiments were carried out with the Al-3wt.%Cu-5.5wt.%Si alloy and the results compared with others from the literature elaborated for upward directional solidification (UDS). For this purpose, a water-cooled directional solidification experimental device was developed, and the alloy investigated was solidified under unsteady-state heat flow conditions. Thermal parameters such as growth rate (VL) and cooling rate (TR) were determined experimentally and correlations among VL, TR, λ1 and HV has been performed. It is observed that experimental power laws characterize λ1 with a function of VL and TRgiven by: λ1=constant(VL)-1.1 and λ1=constant(TR)-0.55. The horizontal solidification direction has not affected the power growth law of λ1 found for the upward solidification. However, higher values of λ1 have been observed when the solidification is developed in the horizontal direction. The interrelation of HV as function of VL, TR and λ1 has been represented by power and Hall-Petch laws. A comparison with the Al-3wt.%Cu alloy from literature was also performed and the results show the Si element affecting significativaly the HV values.
机译:为了分析生长方向对水平方向凝固(HDS)过程中枝晶臂间距(λ1)和显微硬度(HV)的影响,对Al-3wt。%Cu-5.5wt。%Si合金和结果与其他文献进行了比较,该文献详细阐述了向上定向凝固(UDS)。为此,开发了一种水冷定向凝固实验装置,并在非稳态热流条件下凝固了所研究的合金。通过实验确定了热参数,例如生长速率(VL)和冷却速率(TR),并已进行了VL,TR,λ1和HV之间的关联。可以看出,实验功率定律用VL和TR的函数来表征λ1,可通过以下公式得出:λ1= constant(VL)-1.1和λ1= constant(TR)-0.55。水平凝固方向未影响向上凝固时发现的λ1的功率增长规律。然而,当在水平方向上进行凝固时,观察到更高的λ1值。 HV与VL,TR和λ1的函数关系已由幂和霍尔-皮奇定律表示。还与文献中的Al-3wt。%Cu合金进行了比较,结果表明Si元素显着影响HV值。

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