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Corrosion Behavior of Silver-Plated Circuit Boards in a Simulated Marine Environment with Industrial Pollution

机译:镀银电路板在具有工业污染的模拟海洋环境中的腐蚀行为

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The electrochemical corrosion behavior of a silver-plated circuit board (PCB-ImAg) in a polluted marine atmosphere environment (Qingdao in China) is studied through a simulated experiment. The morphologies of PCB-ImAg show some micropores on the surface that act as the corrosion-active points in the tests. Cl ? mainly induces microporous corrosion, whereas SO 2 causes general corrosion. Notably, the silver color changes significantly under SO 2 influence. EIS results show that the initial charge transfer resistance in the test containing SO 2 and Cl ? is 9.847 × 10 3 , while it is 3.701 × 10 4 in the test containing Cl ? only, which demonstrates that corrosion accelerates in a mixed atmosphere. Polarization curves further show that corrosion potential is lower in mixed solutions (between ?0.397 V SCE and ?0.214 V SCE) than it in the solution containing Cl ? only (?0.168 V SCE), indicating that corrosion tendency increases with increased HSO 3 ? concentration.
机译:通过模拟实验研究了污染的海洋大气环境(中国青岛)中镀银电路板(PCB-ImAg)的电化学腐蚀行为。 PCB-ImAg的形貌显示表面上有一些微孔,在测试中充当腐蚀活性点。氯?主要引起微孔腐蚀,而SO 2引起全面腐蚀。明显地,在SO 2的影响下,银的颜色显着改变。 EIS结果表明,在试验中含有SO 2和Cl 2的初始电荷转移电阻。在含Cl?的试验中为9.847×10 3,而在3.701×10 4中为3.7?仅表明腐蚀在混合气氛中加速。极化曲线进一步表明,混合溶液(在?0.397 V SCE和?0.214 V SCE之间)的腐蚀电位比在含Cl?3的溶液中低。仅(?0.168 V SCE),表明腐蚀趋势随HSO 3的增加而增加。浓度。

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