首页> 外文期刊>Frontiers in Physics >A monolithically integrated silicon modulator with a 10 Gb/s 5 Vpp or 5.6 Vpp driver in 0.25 ??m SiGe:C BiCMOS
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A monolithically integrated silicon modulator with a 10 Gb/s 5 Vpp or 5.6 Vpp driver in 0.25 ??m SiGe:C BiCMOS

机译:具有0.25?m SiGe:C BiCMOS的10 Gb / s 5 Vpp或5.6 Vpp驱动器的单片集成硅调制器

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This paper presents as a novelty a fully monolithically integrated 10Gb/s silicon modulator consisting of an electrical driver plus optical phase modulator in 0.25µm SiGe:C BiCMOS technology on one chip, where instead of a SOI CMOS process (only MOS transistors) a SiGe BiCMOS process (MOS transistors and fast SiGe bipolar transistors) is implemented. The fastest bipolar transistors in the BiCMOS product line used have a transit frequency of 120GHz and a collector-emitter breakdown voltage of 2.2V (IHP SG25H3). The main focus of this paper will be given to the electronic drivers, where two driver variants are implemented in the test chips. Circuit descriptions and simulations, which treat the influences of noise and bond wires, are presented. Measurements at separate test chips for the drivers show that the integrated driver variant one has a low power consumption in the range of 0.66W to 0.68W but a high gain of S21=37dB. From the large signal point of view this driver delivers an inverted as well as a non-inverted output data signal between 0V and 2.5V (5Vpp differential). Driver variant one is supplied with 2.5V and with 3.5V. Bit-error-ratio (BER) measurements resulted in a BER better than 10E-12 for voltage differences of the input data stream down to 50mVpp. Driver variant two, which is an adapted version of driver variant one, is supplied with 2.5V and 4.2V, consumes 0.83W to 0.87W, delivers a differential data signal with 5.6Vpp at the output and has a gain of S21=40dB. The chip of the fully integrated modulator occupies an area of 12.3mm^2 due to the photonic components. Measurements with a 240mVpp electrical input data stream and for an optical input wavelength of 1540nm resulted in an extinction ratio of 3.3dB for 1mm long RF phase shifters in each modulator arm driven by driver variant one and a DC tuning voltage of 1.2V. The extinction ratio was 8.4dB at a DC tuning voltage of 7V for a device with 2mm long RF phase shifters and driver variant two.
机译:本文提出了一个新颖的完全单片集成的10Gb / s硅调制器,该调制器由一个电驱动器和一个光学相位调制器组成,并在一个芯片上采用0.25µm SiGe:C BiCMOS技术制造,其中采用了SiGe而不是SOI CMOS工艺(仅MOS晶体管)。实现了BiCMOS工艺(MOS晶体管和快速SiGe双极晶体管)。使用的BiCMOS产品线中最快的双极晶体管具有120GHz的传输频率和2.2V的集电极-发射极击穿电压(IHP SG25H3)。本文的主要重点将放在电子驱动器上,其中在测试芯片中实现了两种驱动器变体。给出了描述噪声和键合线影响的电路描述和仿真。在单独的驱动器测试芯片上进行的测量表明,集成驱动器型号1的功耗低至0.66W至0.68W,但高增益为S21 = 37dB。从大信号的角度来看,该驱动器可提供介于0V和2.5V之间的反相和同相输出数据信号(差分5Vpp)。驱动器型号一提供2.5V和3.5V。对于低至50mVpp的输入数据流电压差,误码率(BER)测量导致BER优于10E-12。驱动器第二种是驱动器第一种的改进版本,提供2.5V和4.2V电压,消耗0.83W至0.87W,在输出端提供5.6Vpp的差分数据信号,增益为S21 = 40dB。由于光子组件的作用,完全集成的调制器芯片占用的面积为12.3mm ^ 2。使用240mVpp电输入数据流和1540nm的光输入波长进行的测量导致,在由驱动器型号1驱动的每个调制器臂中,对于1mm长的RF移相器而言,消光比为3.3dB,DC调谐电压为1.2V。对于具有2mm长的RF移相器和两种驱动器的设备,在7V的DC调谐电压下,消光比为8.4dB。

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