Thermal Characteristics of a Laser Diode Integrated on a Silica-Terraced PLC Platform

摘要

A spot-size converted Fabry-Perot laser diode (LD) was flip-chip bonded to a silica-terraced planar lightwave circuit platform to examine the effect of the silica terrace on the heat dissipation of the LD module. From the measurement of the light-current characteristics, it was known that the silica terrace itself is not a strong thermal barrier but the encapsulation of the integrated LD with an index-matching polymer resin more or less deteriorates the heat dissipation.